Title:
Magnetic Material-Component Interactions for Innovative Electronic Applications

Abstract:
Magnetic material and component structures that favor the trend towards planarization, chip-scale integration, and novel magnetic packaging become the most promising direction of facilitating the development of future power electronics and RF systems. However, conventional design and modeling of magnetic components largely reply on behavioral-level regression methodologies that lack theoretical guidance and feasibility for advanced applications. This talk starts from modeling of external characteristics of magnetic components, and then shifts from macroscopic performance to microscopic behavior for magnetic materials in order to reveal the hierarchy of interactions between material properties and component performances. The developed models not only provide powerful tools for analyzing magnetic-related issues in the next generation of high-frequency and high-density power electronics; but also inspire cross-disciplinary applications such as magnetic-molded packaging, ferromagnetic-resonance wireless power transfer, and multiferroic antennas.

Bio:
Han (Helen) Cui is a postdoctoral scholar in the Department of Electrical and Computer Engineering at the University of California, Los Angeles. She received the B.S. degree in electrical engineering from Tianjin University, Tianjin, China, in 2011, and the M.S. and Ph.D. degrees from Virginia Tech, Blacksburg, in 2013 and 2017, respectively, both in electrical engineering. Her research interests include magnetic components for high-density and low-loss operations; magnetic material modeling and applications in power electronics and RF field.